Welcome to EP Materials Co.,Ltd!
Jingfeng materials professional research and development, production and sale of high-end integrated circuit packaging materials, display and touch screen bonding materials, smart card packaging materials and provide technical advisory services
Jing Feng materials from the United States returned to the high-level research scientists founded, with expert-level technical team and a senior management team, integrated circuit packaging materials in the field of nearly 20 years of mature experience
Jingfeng materials continue to cooperate with a number of domestic research institutions and institutions of higher learning, so that product design and development, production technology and customer service ability to improve rapidly
Jingfeng Electronic Packaging Materials (Wuhan) Co., Ltd. (hereinafter referred to as "Jingfeng Material") is a research and development, production and sale of high-end integrated circuit packaging materials (mainly used for semiconductor packaging high-end packaging materials), display and touch screen bonding Materials, smart card packaging materials and provide technical advisory services related to high-tech enterprises, from the United States returned to the high-level research scientists founded, located in the national independent innovation demonstration area - Hubei Wuhan East Lake High-tech Zone ......
NEWS
Jingfeng team after years of effort, the market share gradually increased,
CONTACT US
Customer Service Hotline：
021-69111956
Office: Wuhan East Lake New Technology Development Zone 999 High-tech Avenue, the future of Science and Technology City C2 Building 604-605
Production and R & D Center: No. 1156, Building C, Wuhan International Student Business Park, No. 73, Chuangye Street, Donghu New Technology Development Zone, Wuhan
Tel: 027-87803993
Fax: 027-87803959
E-mail：austin.s@ecb-tech.com
